Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.
361～390 item / All 1948 items
Emergency lamp that lights up immediately during a power outage.
It is an LED bulb with a built-in battery that lights up immediately during power outages due to disasters. • The lighting time when using the battery is 3 hours. • It consumes very little power, making it ideal for indoor night lights in living rooms, hallways, and entrances.
![[Component Assembly and Various Manufacturing] Flexible Circuit Boards, FPC, Flexible Boards](https://image.mono.ipros.com/public/product/image/308/2000509612/IPROS45740238299848604956.jpeg?w=280&h=280)
From precision component micro-assembly to assembly wiring and electrical testing, leave it all to us!
- SMD mounting, POP mounting - Bare chip mounting (wire bonding, flip chip mounting) - Device resin encapsulation - Cable and housing assembly - Component replacement, modification - Electrical inspection, operational verification
We will support and propose ideas to enhance development capabilities, working closely with the development technology personnel! FPC
- Circuit investigation - Component investigation (creating parts list, investigating constants and sizes, collecting catalogs) - Design specification investigation (minimum hole diameter, minimum L/S investigation) - Substrate destruction investigation (layer composition, plating thickness, inner layer pattern arrangement) - Substrate non-destructive investigation (X-ray transmission, CT images) - Assembly analysis investigation (solder composition, wettability, bonding strength, etc.) - Quality investigation (thermal shock testing, temperature and humidity cycles, etc.) FPC
It is a flexible substrate that combines heat resistance and transparency. FPC
Compared to glass materials, it is possible to create unique design concepts not only for flat surfaces but also for curved surfaces, folding, and wrapping, thereby expanding the design possibilities for mounted devices. It is expected to be used as a substitute for glass substrates in applications such as: - Transparent conductive substrates for touch panels - Organic EL and LED lighting substrates - Displays for mobile phones. Additionally, bare chip LEDs will be implemented on transparent polyimide substrates using wire bonding, followed by resin encapsulation. Light will pass through the transparent polyimide and beautifully illuminate the opposite side.
It is a flexible circuit board that can be repeatedly stretched and contracted, and can follow deformation. FPC
While general flexible materials can be bent, they face challenges in folding and stretching. Due to their flexibility, stretchability, and ability to conform, they are expected to be used in a wide range of fields for flexible electronics devices, including wearables, sensors, displays, robotics, as well as pressure sensors and seat heaters. FPC.
We propose an extremely thin and highly flexible FPC.
It excels in various characteristics such as thinness, lightness, flexibility, resistance to bending, and resistance to breaking. Due to its excellent properties, it is used in movable parts such as sliding and twisting.
It is a flexible substrate effective for high-density wiring. FPC
Unlike conventional through holes, to avoid penetrating the hole, a via is placed directly under the pad. Fine hole processing using lasers is possible, making it effective for ultra-high-density wiring, etc. With the miniaturization and thinning of mobile devices, as well as the enhancement of communication devices, there is an increasing demand for high-density mounting of narrow pitch, multi-pin packages. Consequently, flexible substrates are also advancing in terms of high-layer count and high density. FPC
It is a flexible substrate, FPC, flexible circuit board with noise reduction structure.
This is a flexible substrate with a noise countermeasure structure against radiated noise from FPC, due to the high-speed transmission signal. Suppressing noise radiated by high-speed circuits is important.
Printed Circuit Board Thermal Fluid Analysis Service Thermal Management Support and Assistance FPC
We will conduct thermal fluid analysis (thermal simulation) during the pattern design stage of printed circuit boards. This includes not only predicting heat generation from heat-generating components and analyzing the heat of the patterns, but also considering thermal measures for the entire module, including the housing, from various perspectives. We will provide proposals for thermal measures. Additionally, we will support and assist in the establishment of thermal measures in the medium to long term, not only through our contracted services for pattern design and thermal fluid analysis (thermal simulation). Flexible substrates, flex PCBs, FPC. Achievements: Automotive junction boxes (J/B), relay boxes (R/B), room lamp FPC.
Pattern Width VS Temperature Rise Test FPC
●Setting design and evaluation criteria Creating flexible printed circuits (FPC) with multiple pattern widths, applying several patterns of current, and measuring temperature distribution and pattern voltage drop using a thermal viewer. FPC
3D circuit board [MID wiring (Molded Interconnect Device)] / substrate with embedded electronic components
Our company provides contract design and development of electronic devices (ODM) as well as contract manufacturing services for electronic devices (EMS). We are involved not only in the design and manufacturing of flexible printed circuits but also in circuit design, structural design, software development, cable and harness production, and we collaborate with product development personnel from the planning stage to bring products to market. Various industries are advancing in miniaturization and weight reduction. To differentiate ourselves from competitors while considering mass production efficiency, we propose a wide range of solutions, not limited to flexible printed circuits, including 3D-MID wiring cases with conductor formation on resin housing surfaces and embedded substrates that incorporate electronic components into printed circuit boards. Etching, plating, vacuum deposition, EB deposition, sputtering, thin film formation, photolithography, ion plating, thermal CVD, plasma CVD, dry etching, film ITO, film metal patterning, fine patterns, WLP, silicon wafers, RDL, bump formation, TEG, dry etching, wet etching, MEMS, organic EL, metallization, glass etching, semi-additive etching, transparent resist, transparency, high heat-resistant resin.
Announcing the reference design for the SCD4x CO2 sensor! Equipped with an LED that indicates indoor air quality.
The "SCD4x CO2 Gadget" is a simple reference design circuit board that showcases the excellent performance and ease of use of our SCD4x CO2 sensor product line. It features an LED that indicates indoor air quality based on the measured CO2 concentration. It is equipped with a Bluetooth Low Energy module, allowing communication with Bluetooth SMART compatible devices such as smartphones. Additionally, power is supplied via a standard USB interface. 【Specifications】 ■ Size (L×W×H): 53×19×13mm *For more details, please refer to the related links or feel free to contact us.
Fluid connection is PFA tube! Includes sensor cables and basic fitting set, etc.
We would like to introduce our liquid flow sensor evaluation kit, 'EK-SLQ-QT500'. The maximum flow rate is 120ml/min (for both water-based and hydrocarbon-based fluids). The interfaces (connectors) available are RS485, I2C, USB, or analog (4-pin M8), and the fluid connection is made with PFA tubing. Please feel free to contact us if you have any inquiries. 【Included Items】 ■ SLQ-QT500 ×1 ■ SCC1-USB Sensor Cable ×1 ■ SCC1-Analog Sensor Cable ×1 ■ Basic Fitting Set ■ Quick Start Guide *For more details, please download the PDF or feel free to contact us.
The maximum flow rate is 80 ull/min for the aqueous system and 500 ul/min for the hydrocarbon system evaluation kit!
We would like to introduce our liquid flow sensor evaluation kit, 'EK-SLI-0430'. The maximum flow rate is 80 µL/min (aqueous) / 500 µL/min (hydrocarbon), and it has IP65 waterproof and dust resistance. Additionally, the interfaces (connectors) available are RS485, I2C, USB, or analog (4-pin M8). 【Included Items】 ■ SLI-0430 x 1 ■ SCC1-USB sensor cable x 1 ■ SCC1-Analog sensor cable x 1 ■ Basic fitting set ■ Quick start guide *For more details, please download the PDF or feel free to contact us.
Maximum flow rate 600 ml/min (aqueous and hydrocarbon systems)! Includes ribbon cables and more.
We would like to introduce our liquid flow sensor evaluation kit, 'EK-SLF3S-4000B'. The interface (connector) is I2C (6-pin Molex), with a maximum flow rate of 600 ml/min (for both aqueous and hydrocarbon fluids). Please feel free to contact us if you have any inquiries. 【Included Items】 ■ SLF3S-0600F ×1 ■ SLF3x Mounting Clamp ×1 ■ SCC1-USB Sensor Cable ×1 ■ Adapter cable for connecting from 6-pin connector to SCC1-USB sensor cable ×1 ■ 6-pin Ribbon Cable ×1 ■ Quick Start Guide *For more details, please download the PDF or feel free to contact us.
Maximum flow rate 40ml/min (aqueous)! Includes quick start guide and SCC1-USB sensor cable.
We would like to introduce our liquid flow sensor evaluation kit, 'EK-SLS-1500'. The interfaces (connectors) available are RS485, I2C, USB, or analog (4-pin M8). The maximum flow rate is 40ml/min (water-based) with a response time of 20ms. Please feel free to contact us if you have any inquiries. 【Included Items】 ■ SLS-1500 ×1 ■ SCC1-USB Sensor Cable ×1 ■ SCC1-Analog Sensor Cable ×1 ■ Basic Fitting Set ■ Quick Start Guide *For more details, please download the PDF or feel free to contact us.
Direct heat conduction to the base material!
The "Copper Base Wiring Board with Posts" is a thermally excellent heat dissipation substrate that forms posts on a copper base and connects directly to the surface pattern. It can also be multilayered and is used for high-density mounting substrates for LEDs. 【Features】 ■ High thermal conductivity ■ Short delivery time available ■ Special specifications can be discussed *For more details, please download the PDF or feel free to contact us.
High heat resistance and high strength! Ceramic wiring board using DPC plating method.
The "DPC substrate" is a ceramic wiring substrate that offers higher heat resistance and strength than conventional thick-film printed circuit boards. It is a substrate using the DPC (Direct Plated Copper) plating method, compatible with various materials such as alumina (Al₂O₃), aluminum nitride (AlN), silicon nitride (Si₃N₄), and glass. 【Specifications】 ■ Base material: Compatible with various materials including alumina, aluminum nitride, silicon nitride, and glass ■ Conductor thickness: 10 to 100 μm *For more details, please refer to the PDF document or feel free to contact us.
Introducing products by function such as high frequency, high thermal conductivity, and dimensional stability in a tree diagram!
This document introduces the products of Ain Co., Ltd., which engages in the design, manufacturing, and sales of printed circuit boards, categorized by function. It features various types of multilayer circuit boards (resin, metal, ceramics), including thick film printed circuit boards and inner layer thick copper circuit boards (with busbars). We respond to diverse needs such as high frequency, high thermal conductivity, and dimensional stability. 【Contents】 ■ High Frequency ■ High Thermal Conductivity ■ Dimensional Stability (Low Expansion) ■ High Heat Resistance ■ High Current *For more details, please refer to the PDF document or feel free to contact us.
We will exhibit at a trade show that contributes to the development of the entire electronic circuit industry and related industries!
Ain Co., Ltd. will exhibit at the 'JPCA Show 2026' held at Tokyo Big Sight. This exhibition will showcase electronic circuits and mounting technologies used in various electronic, information communication, and control devices, as well as new content and solutions. We plan to display our thick copper ceramic substrate "AMB substrate" for power devices and our ceramic wiring substrate "DPC substrate" using a plating method. We sincerely look forward to your visit. 【Exhibition Information】 ■ Dates: June 10 (Wed) to June 12 (Fri), 2026, from 10:00 AM to 5:00 PM (tentative) ■ Venue: Tokyo Big Sight ■ Address: 3-10-1 Ariake, Koto-ku, Tokyo 135-0063 ■ Booth Number: East Exhibition Hall 3F-32 ■ Exhibition Zone: Printed Circuit Board Technology Exhibition *For more details, please refer to the PDF document or feel free to contact us.
Leave it to us for circuit boards for power modules! We manufacture thick copper base wiring boards and boards that bond thick copper to ceramics using the AMB method.
We would like to introduce the "Thick Copper Base Wiring Boards" and "AMB Boards" that we handle. The "Thick Copper Base Wiring Board" is available with three grades of insulation layers. We manufacture thick copper base boards for power modules as an alternative to DBC boards and AMB boards (high thermal conductivity and high current). We also handle "AMB Boards," which are thick copper boards bonded to ceramics using the AMB method. These thick copper ceramic boards are designed for power devices and offer high insulation, heat dissipation, and reliability. We can accommodate small quantities, so please feel free to consult with us. 【Specifications of Thick Copper Base Wiring Boards (Partial)】 <Insulation Layer> ■ Thermal Conductivity: 10.0 W/m·K Thickness: 120 μm ■ Young's Modulus: 53 GPa ■ Copper Thickness (Base): 0.5, 1.0, 1.5, 2.0, 3.0 mm ■ Copper Thickness (Wiring): 0.2, 0.3, 0.5, 0.8, 1.0 mm *For more details, please download the PDF or feel free to contact us.
Thin-film process enables the realization of fine and high-precision ceramic wiring boards.
This is a ceramic wiring substrate capable of forming fine patterns through a thin film process. 【Features】 By combining our plating technology, it is also possible to create circuits with different thicknesses on the front and back. Example: Front Cu/Ni/Au, Back Ti/Pt/Au *For more details, please refer to the PDF document or feel free to contact us.
High thermal conductivity alumina (Al2O3) substrate, AlN substrate
● Alumina (Al2O3) substrate Thickness: 0.38mm and above Metallization: MoMn, W, Ni, Ag, Au ● AlN substrate Thermal conductivity 170W/m·k and above Thickness: 0.38mm and above Metallization: Cu, Ti/W, Pt, Ag, Au We will challenge at a low cost.
This is a screwless terminal board for harness inspection compatible with the NACMAN harness checker (harness tester) from Nack Corporation.
This is a screwless terminal board that is convenient for the production of harness inspection jigs. You can easily connect wires to the terminal block with a one-touch connection after stripping the insulation, making jig production simple. To connect or disconnect, just press the button while inserting or pulling out the wire from the insertion hole, and no special tools are required. ~Creating jigs easily, quickly, and flexibly for everyone~ The NMADP-03 is a jig board for harness inspection developed from customer requests. One of the popular products of Nack Corporation, the inspection jig board NMADP-03 features terminal blocks on both sides. It can be challenging to prepare jigs for each inspected item, but this allows for an affordable and easy solution. By connecting the inspection cable to the NM-ADP-03 and wiring from the side terminal block to the item being inspected, you can immediately conduct inspections! With screwless terminals, it allows for one-touch connections without the need for special tools. It also supports high voltage inspections (AC600V, DC500V)! It can be used with various harness checkers, as well as the harness multi-tester NMG+.
We provide custom structure MBE/MOCVD epitaxial growth on compound semiconductor epitaxial InP substrates.
We provide custom structure MOCVD epitaxial growth on GaAs substrates ranging from 2 inches to 6 inches. We offer comprehensive services for GaAs epitaxial substrates to companies, universities, and scientific research institutions, including epitaxial structure design, epitaxial materials, and testing analysis.
Choose the material that suits your purpose! We offer a variety of hard material balls.
Ito Seisakusho Co., Ltd., a manufacturer of general scientific and physical instruments focused on the powder industry, offers "ceramic balls for grinding." Hard material balls include high-purity alumina balls, high-purity alumina beads, alumina balls, zirconia balls, and silicon nitride balls. Please select the material that suits your application. 【Hard Material Balls】 ■ High-purity alumina balls (Al2O3 - 99.9% or higher) ■ High-purity alumina beads (Al2O3 - 99.99%) ■ Alumina balls (Al2O3 - 99.5%) ■ Zirconia balls (ZrO2 - 95%) ■ Silicon nitride balls (Si2N4 - 92%) ■ Titanium oxide balls (TiO2 - 77.7%, Al2O3 - 17.4%, SiO2 - 4.6%) ■ Silicon carbide balls (SiC - 97% and others) ■ High-purity quartz balls, etc. *For more details, please refer to the PDF document or feel free to contact us.
Leave circuit design, printed circuit board pattern design, and board assembly and wiring adjustments to us.
The demand for machine devices that operate through numerical control is increasing for the purpose of efficiency and labor reduction. At Shinshu Koden, we aim to design and manufacture equipment suitable for the era of factory automation with flexible thinking. We can accommodate various needs from prototypes to mass production, so please feel free to consult with us. For more details, please contact us or download the catalog.
We provide one-stop support for OEM/ODM and development projects, from planning and design development to manufacturing, and we can assist with any stage of the process.
At Yamato Technology Research Institute Co., Ltd., we provide comprehensive support for OEM/ODM and development of various products, from planning to manufacturing. We can produce high-quality products in small lots tailored to our customers' needs. 【OEM/ODM and Development Solutions】 ■Development and Design (1) Various Circuit Designs Microcontroller peripheral circuits, various power supply circuits, charging circuits, various wireless communication circuits (LTE, WiFi, Bluetooth, etc.), motor control circuits, applications using LEDs (2) Embedded Microcontroller Software Development System control, memory control, communication control, etc. (3) Enclosure Design Panels, enclosures, etc. (4) PC Application Development Windows application development ■Production 1) Prototype production in small and large lots 2) Reliability evaluation testing 3) Mass production support *Please feel free to contact us for inquiries or consultations.
Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!
Our company manufactures low-loss flexible substrates (GHz band, Microstrip Line). We would like to introduce a flexible substrate that significantly improves transmission loss compared to the combination of polyimide-based and standard coverlay products. Using a PTFE base with a low-dielectric coverlay, we can expect a 60-70% improvement in transmission loss at the 40GHz band compared to standard products. Additionally, while the performance is slightly lower compared to PTFE-based substrates, a combination of LCP base and LCP coverlay can also expect about a 50% improvement in transmission loss and is suitable for long-term heat resistance and low outgassing applications due to the absence of adhesives. *For more details, please refer to the PDF materials or feel free to contact us. *Abbreviation explanations: PTFE ... Fluoropolymer LCP ... Liquid Crystal Polymer
Formation of through holes with a diameter of 25μm or less. Since components can be mounted on top of the vias, space-saving is achieved.
The "Ultra-small diameter through hole" is a flexible substrate designed to have holes filled by 15μm through-hole plating. It is possible to form through holes with a diameter of 25μm or less on double-sided flexible substrates. Additionally, we also offer "4-layer filled blind vias," which allow for the filling of blind vias through plating on 4-layer flexible substrates. 【Specifications】 〈Ultra-small diameter through hole〉 ■ Base polyimide: 50μm ■ Conductor thickness: 12μm ■ Hole diameter (entry side): φ20μm ■ Hole diameter (exit side): φ15μm ■ Land diameter: 95μm *For more details, please refer to the PDF document or feel free to contact us.
