We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

Substrate Product List and Ranking from 577 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.

  1. 共栄電資 Tokyo//Electronic Components and Semiconductors
  2. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  3. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  4. 4 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  5. 5 null/null
Go to Company Ranking

Substrate Product ranking

Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.

  1. Busbar for Data Centers - High Current Board 共栄電資
  2. FPC for the space industry 太洋テクノレックス 本社　和歌山
  3. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  4. 4 PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  5. 5 CAN/CANFD communication is possible with the sequencer! CANNEX サンプロシステム

Substrate Product List

331～360 item / All 1948 items

Displayed results
Thick copper multilayer substrate

Thick copper multilayer substrate

Introducing our product lineup, which covers everything from printed circuit board design and manufacturing to component mounting and assembly.

The "Thick Copper Multi-layer Circuit Board" is a product handled by Arrow Industry Co., Ltd. Our company is capable of creating products that meet customer needs due to our in-house integrated production of printed circuit boards (PCBs). Furthermore, we collaborate with local companies to provide services from PCB design and manufacturing to component mounting and assembly. 【Our Features】 ■ In-house integrated production of printed circuit boards (PCBs) ■ Collaboration with local companies ■ Services from PCB design and manufacturing to component mounting and assembly ■ Proposals and provision of products tailored to customer needs *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other machine elements
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Single-sided copper base board

Single-sided copper base board

Introducing our product lineup that covers everything from printed circuit board design and manufacturing to component assembly and assembly.

The "Copper Base Single-Sided Board" is a product handled by Arrow Industry Co., Ltd. Our company is capable of creating products that meet customer needs, thanks to our in-house integrated production of printed circuit boards (PCBs). Furthermore, we collaborate with local companies to provide services ranging from PCB design and manufacturing to component mounting and assembly. 【Our Features】 ■ In-house integrated production of printed circuit boards (PCBs) ■ Collaboration with local companies ■ Services from PCB design and manufacturing to component mounting and assembly ■ Proposals and provision of products tailored to customer needs *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other machine elements
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
LED-COB module

LED-COB module

Introducing our product lineup that covers everything from printed circuit board design and manufacturing to component assembly and assembly.

The "LED-COB module" is a product handled by Arrow Industries Co., Ltd. Our company is capable of creating products that meet customer needs due to our in-house integrated production of printed circuit boards (PCBs). Furthermore, we collaborate with local companies to provide services from PCB design and manufacturing to component mounting and assembly. 【Our Features】 ■ In-house integrated production of printed circuit boards (PCBs) ■ Collaboration with local companies ■ Services from PCB design and manufacturing to component mounting and assembly ■ Proposals and provision of products tailored to customer needs *For more details, please refer to the PDF document or feel free to contact us.

  • LED Module
  • Other machine elements
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Double-sided through-hole metal substrate

Double-sided through-hole metal substrate

It is possible to efficiently release the heat from the heating components to the outside! Double-sided through-hole metal substrate.

The "Double-Sided Through-Hole Metal Substrate" is a product handled by Arrow Industries, which manufactures and sells substrates for industrial equipment, semiconductor bare chip mounting, and consumer electronics. The substrate is machined to expose the metal core, allowing heat dissipation components such as heat sinks to be directly mounted or connected to the housing, efficiently releasing heat from heat-generating components to the outside. If it has a copper core, the connection between the copper core and the through-hole can enhance heat dissipation. 【Features】 ■ Efficiently releases heat from heat-generating components to the outside ■ If it has a copper core, the connection between the copper core and the through-hole can enhance heat dissipation *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other machine elements
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Heat dissipation countermeasure board

Heat dissipation countermeasure board

For heat dissipation solutions, come to us! We provide comprehensive support from circuit board design to logistics.

Arrow Industries manufactures and sells industrial equipment, semiconductor bare chip mounting substrates, and consumer substrates. In particular, for LED mounting substrates, we are highly regarded for our thermal management metal substrates using high thermal conductivity sheets, as well as structural substrates designed with various heat dissipation pathways. Additionally, we provide a comprehensive service from substrate design and manufacturing to component procurement, component mounting, quality assurance, and logistics. Our company is a solution-oriented enterprise that embodies high quality through a multifaceted perspective on inefficient products. 【Features】 ■ Structural substrates designed with various heat dissipation pathways ■ Comprehensive service from substrate design and manufacturing to component procurement, component mounting, quality assurance, and logistics ■ Embodying high quality through a multifaceted perspective on inefficient products ■ Proposing and providing products tailored to customer needs from substrate design to component mounting and assembly *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Contract manufacturing
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Hybrid substrate for UV LED ultraviolet protection

Hybrid substrate for UV LED ultraviolet protection

Countermeasures against component degradation caused by UV LEDs! A UV-resistant special substrate made by combining a copper base substrate and a glass epoxy substrate.

The "hybrid substrate" developed by our company refers to a composite substrate that combines "copper-based substrate" and "glass epoxy substrate," designed to prevent degradation of connectors and components due to ultraviolet (UV) light, which is a problem with substrates equipped with UV LEDs. It features a special shape where the glass epoxy substrate is embedded in the copper-based substrate. By placing the connector on the backside of the UV LED, it protects against degradation from UV light. By partially forming through-holes, it allows for component mounting, such as connectors, on the backside while being a metal-based substrate, thus preventing degradation of components from UV light. ○ Features - Prevention of component degradation from UV light - High heat dissipation - Relaxation of constraints on component placement - Metal base ○ Applications - Exposure UV-LED modules - Lighting UV-LED modules etc.

  • LED Module
  • Circuit board design and manufacturing
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Arrow Industries for special substrates (metal substrates, heat dissipation substrates, UV protection substrates)

Arrow Industries for special substrates (metal substrates, heat dissipation substrates, UV protection substrates)

Introduction of high-power modules, heat dissipation measures for UV-LEDs, and UV protection substrates for UV-LEDs.

<Heat Dissipation Measures with Special Substrates> - Metal (Copper/Aluminum) Bump Substrate A substrate that utilizes the metal bump areas, which remain after etching a copper plate, for heat dissipation. The structure connects heat sinks of UV-LEDs, high-brightness LEDs, and high-power semiconductors directly to the metal bump areas, allowing heat to escape efficiently. - Water-Cooled Flow Path Circuit Substrate A high heat dissipation substrate that integrates a water-cooled heat sink directly onto a metal base substrate. This is effective in situations where standard heat sinks are insufficient for heat dissipation, or for devices like UV-LEDs that have poor conversion efficiency and require essential thermal management. <UV Protection Substrates for UV-LEDs> - Hybrid Substrate A hybrid substrate developed to prevent degradation of connectors due to ultraviolet light, combining a copper base substrate with a glass-epoxy substrate. By partially forming through-holes, it allows for component mounting, such as connectors, on the back side while still being a metal base substrate, thus preventing degradation of components from ultraviolet light. - Inorganic Resist Coated Substrate An inorganic resist coated substrate that maintains high reflectivity even in the UV-C range, designed for long-term reliability. It is applied to the substrate as a measure against degradation from UV light and as a high-reflectivity material.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • LED lighting
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
UV high-reflective resist substrate

UV high-reflective resist substrate

Heat dissipation performance and durability are fused! UV high-reflective resist enables long lifespan for mounted components and substrates.

The developed UV high-reflective resist substrate features a metal substrate (copper or aluminum) with high heat dissipation properties, which is used as a heat dissipation substrate. By applying a self-developed inorganic resist ink, it prevents the degradation of the resist on the substrate. Furthermore, this resist ink has successfully achieved over 80% reflection of ultraviolet light (UV-A, UV-B, UV-C). In the case of standard white resist, prolonged exposure to UV light causes the resist applied on the substrate to yellow and degrade. By using our self-developed UV high-reflective resist, we can prevent substrate degradation and efficiently reflect UV-LED light. 【Features】 ■ Self-developed product ■ Maintains high reflectivity even in the UV-C range ■ Requires long-term reliability *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Tsukuba Drawing Co., Ltd. Network Solutions

Tsukuba Drawing Co., Ltd. Network Solutions

Providing a consistent product from design to implementation.

We are a group of experts in substrate design, utilizing advanced core technologies and the latest design techniques in the field of printed circuit boards, where high reliability is required. To meet the various demands of our customers, we make the most of our partner network. We provide satisfactory products.

  • Other network tools
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Achieving short delivery times for multilayer printed circuit boards *Delivery possible in as little as 2 days!

Achieving short delivery times for multilayer printed circuit boards *Delivery possible in as little as 2 days!

High quality and high performance! Delivery of high multilayer printed circuit boards in as little as 2 days.

At Fujii Print Industry Co., Ltd., we have achieved short delivery times for multilayer printed circuit boards. High-difficulty boards that require severe precision and intricacy are our specialty. The technological expertise cultivated through cutting-edge board manufacturing is present in all of our products. We deliver high-quality, high-performance multilayer printed circuit boards with more than 10 layers in as little as 2 days. 【Product Lineup】 ○ Single-sided printed circuit boards ○ Double-sided printed circuit boards ○ Multilayer printed wiring boards For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Business Content: Electronic Device Development

Business Content: Electronic Device Development

Supporting the development of new products at every stage! We support manufacturing.

From the development, design, and manufacturing of electronic devices to product commercialization support, the Fuji Print Industrial Group plays a role in supporting cutting-edge manufacturing. The areas we handle cover almost all categories related to electronic devices. Furthermore, we have established a system that allows orders to be placed from any part of the necessary operations, from consulting to manufacturing, enabling a customer-oriented and flexible response. 【Features】 - Support for not only new designs but also renewal designs - Capable of designing ASICs and single-chip microcontrollers - Proposals for design changes and process changes - Support for surface mount, discrete, and mixed boards, accommodating large, irregular shapes, and multilayer boards - Capable of handling various adjustments and inspections For more details, please contact us or download the catalog.

  • Other electronic parts
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Improved heat dissipation and miniaturization of substrates with 'copper embedded (copper inlay) substrates'

Improved heat dissipation and miniaturization of substrates with 'copper embedded (copper inlay) substrates'

Achieves high heat dissipation! A lightweight substrate with a highly thermally conductive copper plate embedded beneath the heat dissipation component.

"Implanted copper substrates" are boards that embed high thermal conductivity copper plates (398W/mk) beneath heat dissipation components. By locally embedding copper plates in areas that need heat dissipation, they are more cost-effective and lighter than copper core substrates. 【Reasons to Choose This Product】 - Compatible with any base material! - Cost-effective heat dissipation compared to increasing copper thickness! - Takes up less space compared to using heat sinks, enabling miniaturization! - The size of the embedded copper can start from 2.0mm in width (negotiable). For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Printed circuit board "Side plating / Dissimilar material bonding / Cavity substrate"

Printed circuit board "Side plating / Dissimilar material bonding / Cavity substrate"

Achieve shield effect! Side plating substrate capable of forming half-through holes on the side parts.

At Meito Electric Co., Ltd., we manufacture and sell printed circuit boards such as "side-plated substrates," "dissimilar material laminated substrates," and "cavity substrates." The "side-plated substrate" achieves a shielding effect by applying plating treatment to the outer edge surface of the substrate. The "dissimilar material laminated substrate" allows for combinations tailored to your needs, such as laminating high-frequency materials with epoxy resin. The "cavity substrate" can be produced more easily than structures that embed electronic components into the substrate. 【Features】 ○ Side-plated substrate: → Half through-holes can be formed on the side surface → Plating can also be formed around the entire circumference of the substrate's side surface ○ Dissimilar material laminated substrate: → Various sizes are available to accommodate small quantities of diverse multilayer workpieces → Supports surface treatments such as heat-resistant flux, lead-free solder leveling, and gold plating ○ Cavity substrate: → Enables low-profile modules *For more details, please refer to the PDF document or contact us directly.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Meito Electric Co., Ltd. Major Equipment Introduction

Meito Electric Co., Ltd. Major Equipment Introduction

High technology supporting the industrial society! Meito Electric Industry Co., Ltd. plays a part in that.

Meito Electric Co., Ltd. started processing and selling electrical insulation materials in 1967 and began manufacturing and selling printed circuit boards in 1983. The range of products we handle is widely used in applications such as automotive, communication equipment, housing-related, and industrial machinery, among others. We would like to introduce our main equipment that seeks higher precision. 【Main Equipment】 ○ Design Department: Design Room, Laser Plotter Room ○ Third Factory: NC Drill, NC Router ○ Shimizu Factory: Desmear Line, Copper Plating Line ○ Second Factory: Exposure Room, Etching Line, AOI Inspection Room, Screen Printing Machine For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Contract measurement
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Technical documentation on "high heat dissipation of substrates" necessary for product miniaturization.

Technical documentation on "high heat dissipation of substrates" necessary for product miniaturization.

Handbook on 'Improving Heat Dissipation of PCBs' is now available! High heat dissipation of PCBs is essential for miniaturizing products! Includes advantages and disadvantages of using copper and aluminum.

In the miniaturization of products, enhancing the thermal dissipation of the substrate is essential. Heat sinks are used to improve thermal conductivity, but they take up extra space, which contradicts the goal of miniaturization. Meito Electric specializes in processing that improves the thermal dissipation of substrates by using aluminum and copper as conductors. ★ We have a proven track record in various fields, including automotive substrates and LED substrates! We are currently offering technical materials related to improving substrate thermal dissipation for free! These materials also include the advantages and disadvantages of substrates made from copper and aluminum. *If you would like the technical materials, please feel free to download them or contact us.

  • Contract manufacturing
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Improving heat dissipation across the entire substrate! The "aluminum core substrate" is lighter than the copper core substrate.

Improving heat dissipation across the entire substrate! The "aluminum core substrate" is lighter than the copper core substrate.

For high current substrate applications! The "aluminum core substrate," lighter than copper core substrates, also improves overall heat dissipation.

"Aluminum core substrate" is a suitable substrate when you want to improve heat dissipation throughout the substrate while also reducing weight compared to copper core substrates. 【Features】 ● Excellent thermal conductivity ● Industry's highest dielectric breakdown voltage ● Lower dielectric constant compared to epoxy resin substrates *For more details, please refer to the PDF materials or contact us directly.

  • LED Module
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
PTFE material IVH substrate *Technical documentation available

PTFE material IVH substrate *Technical documentation available

Non-through IVH substrate made of polytetrafluoroethylene material! We also offer high-quality, highly reliable custom-made substrates using our unique technology.

The PTFE IVH substrate is a non-through IVH substrate made from polytetrafluoroethylene material. Our company manufactures composite multilayer substrates composed of bonded dissimilar materials. (We also produce various other types of substrates.) IVH and BVH structures using composite materials such as Teflon + FR-4 and PPE + FR-4 are possible. We can also bond copper and aluminum with substrate materials or multilayer substrates, and we can develop our processing technology to create custom substrates that meet your requirements. 【Substrate Specifications】 ● Bonded material thickness: 0.1t and above ● Line space: 100/100μm, intersection ±50μm ● Surface treatment: water-soluble heat-resistant flux, lead-free solder leveling, Au flash, etc. *For more details, please refer to the PDF document or contact us directly.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Thin film circuit substrate (submount/carrier) *Technical materials available for free!

Thin film circuit substrate (submount/carrier) *Technical materials available for free!

Application of film formation technology and thin film processing technology to submounts with increasing demand!

Our company applies and develops the film formation and thin film processing technologies cultivated in the manufacturing of thin film magnetic heads (HDD, FDD) and optical prism components to create thin film electrodes, resistive films, and solder films tailored to substrates such as ceramic substrates, forming them into high-precision fine circuit patterns. We are also capable of patterning on three-dimensional surfaces and thick film Cu plating. Our customers use our products not only in Japan but also in various countries around the world, including Asia and Europe and the Americas. We will continue to develop new technologies in the future. ■ Standard substrate materials (thermal conductivity W/m·K) AlN (170~230) AlN/Cu (~270) SiC (~370) ■ Applications Laser diode (LD) mounting substrates Light-emitting diode (LED) mounting substrates Photodiode (PD) mounting substrates ■ Laser market applications Visible light semiconductor lasers Optical communication (FTTx, data centers, mobile base stations) Consumer industrial applications (sensors, LiDAR, laser processing, medical) Lighting (projectors, automotive headlights), etc.

  • 【採用】ガルバノ４.jpg
  • サブマウント.png
  • 0930_022s.jpg
  • Circuit board design and manufacturing
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Hydraulic press machine, powder forming machine

Hydraulic press machine, powder forming machine

It comes with a swing arm type mold transfer device.

We provide high-precision hydraulic molding machines tailored to various materials. Our knowledgeable staff, well-versed in the characteristics of materials, designs and manufactures custom solutions to meet the specifications and environments of individual users. In addition to high quality and durability, we achieve shorter processing times and higher efficiency for our customers, earning us high praise.

  • Powder Molding Machine
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Printed Circuit Board Assembly "Demonstration Experiment Report" *Free Gift Available

Printed Circuit Board Assembly "Demonstration Experiment Report" *Free Gift Available

A report filled with amazing know-how is available for free! With the experience and knowledge unique to mass production factories, we offer prototype services that prototype factories cannot provide!

The "proposal-type prototyping" that solves the troubles of developers and designers often encounters design-related defects during our long-term mass production. When we raise issues, we frequently hear the phrase, "There were no problems during prototyping." Additionally, it is not uncommon to proceed with mass production knowing that making design changes at this stage is cumbersome. When problems arise during mass production, designers often receive harsh words from the manufacturing and quality departments, such as "This is a design issue!" At Reship Electronics, we have extensive mass production experience across a wide range of fields, including automotive, industrial machinery, consumer electronics, and amusement, and we are well-acquainted with the characteristics of each market. Utilizing that knowledge and experience, we extract improvement points with an eye toward mass production even at the prototyping stage, and we propose solutions to prevent quality and cost issues during mass production. *Prototyping Plan 1: As long as functional evaluation can be performed, that's good enough. ⇒ We will produce according to your requests. *Prototyping Plan 2: We will conduct a final functional evaluation of the prototype, but I believe this design will be the basis for mass production. ⇒ We will identify potential quality risks and challenges for efficient production that may arise during mass production and propose improvement plans.

  • Printed Circuit Board
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[Information] Reship Electronic News Vol. 4

[Information] Reship Electronic News Vol. 4

Supporting integrated production from design, procurement, production to assembly! Introducing the technology department that supports Reship Electronics!

Our "Circuit Board CAD Department" started operations at Reship (then Sanyo Electric Manufacturing) in 1992 to conduct circuit board design in-house for the Reship Group. This document includes an "Introduction to the Circuit Board CAD Department," "Equipment Owned," and "Highlights of Factory Tours," among other sections. We invite you to read it. 【Contents (partial)】 ■ Introduction to the Circuit Board CAD Department ■ Equipment Owned ■ DENSHi Column ■ Highlights of Factory Tours ■ Flow of Factory Tours *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Hirai Precision Industry Co., Ltd. Ceramic Processing Technology Introduction

Hirai Precision Industry Co., Ltd. Ceramic Processing Technology Introduction

Foundation technology advantageous for miniaturization of modules!

Ceramic processing is a processing technology that uses glass-ceramic substrates with a thermal expansion coefficient close to that of silicon. Glass-ceramic substrates can be fired at temperatures below 1000°C, allowing the use of Ag, AgPd, and Au as internal conductors. Additionally, since the dielectric constant is lower than that of alumina substrates, signal delay is also minimized. The thermal expansion coefficient being close to that of silicon makes direct die bonding and flip chip (FC) connections to the substrate easier. 【Features】 - Advantageous for miniaturization of modules - Direct die bonding and flip chip (FC) connections to the substrate are easy *For more details, please refer to the catalog or feel free to contact us.

  • others
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Tohoku University Technology: Nitride semiconductor freestanding substrate production method: T14-121

Tohoku University Technology: Nitride semiconductor freestanding substrate production method: T14-121

Able to product GaN at low cost by forming of nitride semiconductor crystal boules

Recently, III-nitride semiconductors (GaN and InGaN) have been attracting attention as semiconductor materials for light-emitting devices such as LED and lasers. This nitride semiconductor has a bandgap energy with wide range wavelengths from infrared to ultraviolet light, and it is a promising material for blue & green LED and semiconductor lasers with UV to infrared region emission wavelengths. However, in the case of nitride semiconductors, the equilibrium vapor pressure between the gas and solid phases of nitrogen is much higher than the conventional III-V materials, so it is not possible to fabricate GaN single crystal substrates at low cost. Another option is to use freestanding GaN substrates, but the current fabrication techniques are costly. 　This invention is able to fabricate nitride semiconductor freestanding substrates with low threading dislocation density at a low cost. This invention comprises a total of seven steps, from the process of forming a buffer layer having a nitride semiconductor on the growing substrate main surface, to the process of fabricating a plurality of nitride semiconductor freestanding substrates.

  • others
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Tohoku University Technology: Substrate with AlN Film and Manufacturing Method: T13-034

Tohoku University Technology: Substrate with AlN Film and Manufacturing Method: T13-034

It is possible to produce a "super high quality" aluminum nitride film on inexpensive sapphire substrates!

Ultraviolet light-emitting devices are widely attracting attention as next-generation light sources for applications such as alternatives to fluorescent lamps, high-density DVDs, biochemical lasers, decomposition of pollutants using photocatalysts, He-Cd lasers, and alternatives to mercury lamps. These ultraviolet light-emitting devices consist of AlGaN-based nitride semiconductors, known as wide-gap semiconductors, which are layered on heterogeneous substrates such as sapphire. However, there have been challenges with the AlN films grown on sapphire, which contain numerous threading dislocations and exhibit poor quality. The present invention significantly improves the crystallinity of the AlN films through a simple method of thermally treating substrates with AlN films grown on sapphire in an N2/CO mixed gas.

  • others
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Custom power supply circuit board for railway vehicles.

Custom power supply circuit board for railway vehicles.

We will provide power supply units with excellent mass production capabilities, utilizing the extensive production know-how cultivated in the implementation industry.

The characteristic of our in-house power supply is its excellent mass production capability. To reduce mass production costs and improve mass production quality, we will make the most of our 35 years of implementation know-how and component procurement know-how. Additionally, regarding production locations, we can choose from Japan (Tochigi Prefecture) and China (Shenzhen in Guangdong Province, Wuxi in Jiangsu Province), regardless of lot size. We have established a system where all bases can perform production at the same level.

  • Circuit board design and manufacturing
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[Case Study] IH Soldering Equipment

[Case Study] IH Soldering Equipment

We are engaged in environmentally friendly manufacturing using equipment and processes that minimize the use of CO2, solder, and VOCs.

We would like to introduce a case where we switched from point dip soldering to our "IH soldering equipment." This change was implemented with the goals of "reducing the amount of solder and flux used" and "contributing to carbon neutrality while enhancing corporate value." As a result of the implementation, we achieved a 29% reduction in solder usage, zero liquid flux usage, and an 85% reduction in power consumption. While production efficiency may decrease slightly, we can perform environmentally conscious soldering, and by manufacturing with Dainikko, we believe we can create environmentally friendly products. We encourage you to consider manufacturing with Dainikko to enhance your corporate value. [Purpose of Implementation] ■ Improve yield rate ■ Reduce the amount of solder and flux used ■ Contribute to carbon neutrality and enhance corporate value *For more details, please download the PDF or feel free to contact us.

  • Soldering Equipment
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Canon Components Electronic Circuit Business

Canon Components Electronic Circuit Business

We conduct a consistent business from development to manufacturing and sales.

The printed circuit board, which serves as the most important base component in the electrical units used in Canon products. Canon Components has been involved in the design of this printed circuit board since the early stages of product development.

  • Other machine elements
  • Other machine elements
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
TAB flexible substrate

TAB flexible substrate

Quality improvement is achievable through the non-contact method using the reel-to-reel process! Please consult us first, regardless of large lots.

The printed circuit board "TAB flexible board" supports a variety of FPCs from prototyping to mass production through R to R lines. Additionally, we conduct simulations from the circuit design stage to provide high-performance, high-quality products. All products are quality assured through automatic visual inspection and electrical testing. We possess a variety of analytical equipment to confirm quality and measure/length at each stage. We offer FPCs compliant with RoHS and made from flame-retardant materials. 【Features】 ■ Mass production of FPCs is realized through R to R ■ We have Ni (nickel)/Au (gold) electroplating equipment to achieve quality that meets customer needs ■ The structure formation of inner leads for connection points is realized *For more details, please request materials or view the PDF data available for download.

  • Printed Circuit Board
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Interposer flexible substrate

Interposer flexible substrate

Are you having trouble procuring build-up substrates for the main board?

By adopting it for the IC substrate of the locally high-density part of the main board, it achieves a reduction in the specifications of the main board, which can be used for semiconductor packages and lead frames.

  • Other semiconductors
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Flexible printed circuit board [Reel to Reel method]

Flexible printed circuit board [Reel to Reel method]

We can accommodate everything from mass production to small-batch, diverse production! We contribute to the miniaturization and slimness of modules, expanding design flexibility!

We would like to introduce our "Flexible Printed Circuit Board Production." With the "Reel to Reel Method," we achieve high productivity through automation, including feeding and winding, and can produce high-quality TAB/COF using a non-contact method that minimizes human intervention. Additionally, we also conduct production in sheet form, allowing us to meet a wide range of customer demands. 【Features】 ■ Capable of producing from mass production to small quantities of various types - Supported by both reel to reel method and sheet production ■ Production of high-density fine wiring flexible substrates ■ Line/Space: Below 30μm pitch ■ VIA hole filling copper plating *For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials
  • Other electronic parts
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Search Keywords Related to Substrate

COPYRIGHT © 2001-2026 IPROS CORPORATION ALL RIGHTS RESERVED.